
Low thermal conductivity materials are porous structural materials with porosity levels often exceeding 90%. Due to their highly porous structure, the trapped and non-moving air within the material provides excellent thermal insulation and lightweight characteristics. In many cases, the thermal conductivity can be lower than 0.02 W/mK.
When these low thermal conductivity materials are incorporated into film applications, they can effectively reduce heat transfer through the film, improving thermal insulation performance and enhancing temperature retention capabilities.

▲ High Thermal Insulation Film
Through KCI’s functional masterbatch processing technology, low thermal conductivity materials have been successfully incorporated into plastic films. Comparative testing between thermal insulation films and standard film samples clearly demonstrates the insulation performance of the film under a -10°C environment.
First, the cooling rate of the high thermal insulation film is significantly slower than that of the control sample. Second, under the same testing duration, the internal temperature of the insulation film remains approximately 4–5°C higher than the standard film.
The primary reason for this improved performance is the highly porous structure of the low thermal conductivity material. The trapped air within the material effectively reduces heat transfer, resulting in slower temperature loss and improved thermal retention.


Diverse Applications of High Thermal Insulation Films: